Description USES MFlow 932AN is ideal for applications requiring high-strength bonding and durable grouting, including: Fixing and grouting of heavy machinery and equipment Anchoring of starter bars, bolts, and fasteners Under-grouting of base plates and machine foundations Precision bedding for turbines, compressors, and pumps Fixing of rail tracks, crane rails, and other structural components Grouting for bridge bearings, mechanical joints, and heavy-duty infrastructure Suitable for both static and dynamic load-bearing applications in demanding conditions FEATURES High Early Strength: Fast strength development for early-load applications. Non-Shrink: Prevents volume loss and ensures long-term stability. Moisture Resistant: Ideal for use in wet or damp conditions, providing reliable performance. Impact and Vibration Resistant: Perfect for machinery and equipment subject to constant movement. Corrosion and Chemical Resistance: Resists harsh environmental conditions, ensuring longevity. High Bond Strength: Strong adhesion to steel, concrete, and other materials. Low Thermal Expansion: Minimizes the risk of cracking due to temperature changes. Ready-to-Mix: Comes in pre-measured components for ease of use and consistent results. PRODUCT INFORMATION Composition: Epoxy resin with high-performance aggregates and fillers Packaging: Supplied in 30 kg kits (Part A Part B Part C) Shelf Life: 12 months from the production date when stored in proper conditions Storage Conditions: Store in a dry, cool area between 5°C and 30°C, away from sunlight and moisture. Keep containers sealed. Appearance and Color: Grey or as specified Density: Approximately 1.92 kg/l (mixed at 25°C) TECHNICAL INFORMATION Compressive Strength: ≥ 85 N/mm² (7 days at 25°C) (ASTM C579, BS 6319) Flexural Strength: ≥ 30 N/mm² (7 days at 25°C) (ASTM C580) Tensile Strength: ≥ 12 N/mm² (7 days at 25°C) (BS 6319) Coefficient of Thermal Expansion: ~4.5 x 10⁻⁵/°C (ASTM C531) Effective Bearing Area: ≥ 85% (ASTM C1339) Working Temperature Range: Applied at temperatures between 5°C and 40°C Pot Life: At 25°C: ~60 minutes At 40°C: ~30 minutes APPLICATION INFORMATION Layer Thickness: Minimum grout depth: 20 mm Maximum grout depth: 80 mm Ambient Temperature: Minimum: 20°C / Maximum: 40°C Substrate Temperature: Minimum: 15°C / Maximum: 40°C Substrate Moisture Content: ≤ 4% for optimal adhesion Dew Point: Ensure the substrate temperature is at least 3°C above the dew point to avoid condensation during application. Mixing Method: Mix the components using a mechanical mixer for consistent results. Add the appropriate amount of water if necessary to achieve the desired consistency. Curing Time: Full curing occurs within 7 days at 25°C. Cooler temperatures may extend curing times.
